• E9685D82-CCE1-4B8F-A8CC-16A98A319E9A
  • 113AED8E-803A-46BE-AA8B-9412ED3D7EFE
  • 75EE4249-B5F6-4074-8400-4C7798DFAF99

Place Category: Components, Semiconductor, and Turnkey Packaging Parts

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  • Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the largest package and test portfolios in the world. Founded in 1972, Carsem is among the most experienced companies in the industry and it is recognized as one of the largest in unit volume production. The company has over 9,000 employees and assembles in excess of 100 million units each week, more than 65 percent of this volume is fully electrically tested product. Carsem is a member of one of Southeast Asia’s most successful and respected corporations, the Hong Leong Group, where semiconductors assembly and test has been considered a core business for over 25 years.

     

    Carsem’s portfolio is at the leading edge of packaging & test technology and is a world leader in the manufacture of the MLP package with over 12 billion units shipped world-wide. The recently introduced ultra small X3 MLP package is the equivalent of the 0201 outline and represents the industries’ smallest MLP production package. Carsem’s SiP (System-in-Package) solution incorporates multiple die and/or passive components assembled in leadframe based format. Carsem’s advanced process solutions include, Flip-Chip on Leadframe (FCOL), Chip on Lead (COL) & Copper Clip/Strap technologies. These three process solutions are offered in the complete range of Carsem’s packages.

    All Carsem factories maintain world-class quality standards, having achieved IATF 16949, ISO-9001, ISO-14001, ANSI/ESD S20.20 certifications and comply with the Sony Green Partner Program.

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